Monday, February 14, 2005
[PRESS RELEASE] InterDigital Announces Availability of Standards Compliant HSDPA Coprocessor and Protocol Stack
InterDigital Announces Availability of Standards Compliant HSDPA Coprocessor and Protocol Stack
CANNES, France--(BUSINESS WIRE)--Feb. 14, 2005--
Cost-Effective, High Performance Solution Enables Semiconductor and
Handset Manufacturers to Differentiate Their Advanced 3G Product
Offerings and Accelerate Time to Market
InterDigital Communications Corporation (Nasdaq:IDCC), a leading architect, designer and provider of wireless technology and product platforms, today announced that its standards compliant UMTS FDD HSDPA (High Speed Downlink Packet Access) coprocessor for mobile devices is now available for technology transfer. The HSDPA solution supports peak data rates of up to 14Mbps.
InterDigital's 3GPP Release 5 standards compliant HSDPA technology solution for mobile terminals is a cost-effective coprocessor solution that can be easily integrated with existing UMTS FDD Release 99/Release 4 physical layer chips, enabling semiconductor and handset manufacturers to differentiate their advanced 3G product offerings and accelerate time to market.
Mark Lemmo, Senior Business Development Officer stated, "As the 3G market matures and end user demand for data-intensive and advanced multimedia applications continues to grow, wireless operators and equipment manufacturers seek ways to increase profitability, grow their customer base and reduce costs. InterDigital's HSDPA coprocessor solution provides a cost-effective, high performance product to deliver differentiated devices that support data-intensive services. Our product enables operators to offer new, attractive high bandwidth services, enhance quality of service and increase network traffic and capacity. The HSDPA product is an advanced receiver-based solution designed to enable higher data rates and low power consumption. It also is easy to integrate with existing FDD solutions, which helps our customers get their products to market faster."
The solution is offered as technology blocks for incorporation into UMTS FDD Release 99/Release 4 chips and as a separate coprocessor chip for initial deployment. It is configurable for receive diversity or single antenna operation. InterDigital is targeting third quarter 2005 delivery for ASIC implementation.
InterDigital also offers a complete, standards compliant UMTS FDD Release 5 protocol stack solution that supports HSDPA data rates of up to 14Mbps. The UMTS FDD software protocol stack product for terminal devices is a cost-efficient solution that can be rapidly ported to an equipment manufacturer's wireless terminal platform.
The Company is showcasing a live demonstration of its HSDPA technology solution this week at 3GSM World Congress in Cannes, France. The demonstration features an application of streaming video over an HSDPA enabled PC card while dynamically adapting to changing channel conditions. To view the HSDPA demo or learn more about InterDigital's technology and product solution offerings, visit InterDigital's booth in Hall 2, Stand E34 or contact sales@interdigital.com.
About InterDigital
InterDigital architects, designs and provides advanced wireless technologies and products that drive voice and data communications. The Company offers technology and product solutions for mainstream wireless applications that deliver time-to-market, performance and cost benefits, as well as product differentiation advantages to its customers. InterDigital has a strong portfolio of patented technologies covering 2G, 2.5G, 3G and 802 standards, which it licenses worldwide. For more information, please visit InterDigital's web site: www.interdigital.com. InterDigital is a registered trademark of InterDigital Communications Corporation.
CONTACT: InterDigital Communications Corporation
Media Contact:
Dawn Goldstein, 610-878-7800
e-mail: dawn.goldstein@interdigital.com
or
Investor Contact:
Janet Point, 610-878-7800
e-mail: janet.point@interdigital.com
SOURCE: InterDigital Communications Corporation
CANNES, France--(BUSINESS WIRE)--Feb. 14, 2005--
Cost-Effective, High Performance Solution Enables Semiconductor and
Handset Manufacturers to Differentiate Their Advanced 3G Product
Offerings and Accelerate Time to Market
InterDigital Communications Corporation (Nasdaq:IDCC), a leading architect, designer and provider of wireless technology and product platforms, today announced that its standards compliant UMTS FDD HSDPA (High Speed Downlink Packet Access) coprocessor for mobile devices is now available for technology transfer. The HSDPA solution supports peak data rates of up to 14Mbps.
InterDigital's 3GPP Release 5 standards compliant HSDPA technology solution for mobile terminals is a cost-effective coprocessor solution that can be easily integrated with existing UMTS FDD Release 99/Release 4 physical layer chips, enabling semiconductor and handset manufacturers to differentiate their advanced 3G product offerings and accelerate time to market.
Mark Lemmo, Senior Business Development Officer stated, "As the 3G market matures and end user demand for data-intensive and advanced multimedia applications continues to grow, wireless operators and equipment manufacturers seek ways to increase profitability, grow their customer base and reduce costs. InterDigital's HSDPA coprocessor solution provides a cost-effective, high performance product to deliver differentiated devices that support data-intensive services. Our product enables operators to offer new, attractive high bandwidth services, enhance quality of service and increase network traffic and capacity. The HSDPA product is an advanced receiver-based solution designed to enable higher data rates and low power consumption. It also is easy to integrate with existing FDD solutions, which helps our customers get their products to market faster."
The solution is offered as technology blocks for incorporation into UMTS FDD Release 99/Release 4 chips and as a separate coprocessor chip for initial deployment. It is configurable for receive diversity or single antenna operation. InterDigital is targeting third quarter 2005 delivery for ASIC implementation.
InterDigital also offers a complete, standards compliant UMTS FDD Release 5 protocol stack solution that supports HSDPA data rates of up to 14Mbps. The UMTS FDD software protocol stack product for terminal devices is a cost-efficient solution that can be rapidly ported to an equipment manufacturer's wireless terminal platform.
The Company is showcasing a live demonstration of its HSDPA technology solution this week at 3GSM World Congress in Cannes, France. The demonstration features an application of streaming video over an HSDPA enabled PC card while dynamically adapting to changing channel conditions. To view the HSDPA demo or learn more about InterDigital's technology and product solution offerings, visit InterDigital's booth in Hall 2, Stand E34 or contact sales@interdigital.com.
About InterDigital
InterDigital architects, designs and provides advanced wireless technologies and products that drive voice and data communications. The Company offers technology and product solutions for mainstream wireless applications that deliver time-to-market, performance and cost benefits, as well as product differentiation advantages to its customers. InterDigital has a strong portfolio of patented technologies covering 2G, 2.5G, 3G and 802 standards, which it licenses worldwide. For more information, please visit InterDigital's web site: www.interdigital.com. InterDigital is a registered trademark of InterDigital Communications Corporation.
CONTACT: InterDigital Communications Corporation
Media Contact:
Dawn Goldstein, 610-878-7800
e-mail: dawn.goldstein@interdigital.com
or
Investor Contact:
Janet Point, 610-878-7800
e-mail: janet.point@interdigital.com
SOURCE: InterDigital Communications Corporation
